Apple and AMD are set to embrace TSMC’s advanced 3D fabric technology for their next-generation high-performance computing devices. The comprehensive 3D fabric technology developed by Taiwan Semiconductor Manufacturing Company (TSMC) encompasses 3D silicon stacking and advanced packaging technologies. This technology will enable Apple to deliver superior performance in its higher-end Mac desktops and MacBooks, catering to demanding tasks like high-end video editing, graphics applications, streaming live sporting events, rendering special effects, AI, and machine learning.
The growing demands of cloud computing, big data analytics, artificial intelligence, neural network training, AI inferencing, mobile computing on advanced smartphones, and self-driving cars require advanced computing capabilities. Packaging technologies have become critical for optimizing a product’s performance, functionality, and cost. The necessity to design products more holistically as a system of mini-chips rather than a monolithic die has prompted the adoption of TSMC’s 3D fabric technology.
This recent development comes as no surprise since earlier this year, Patently Apple reported that TSMC’s 3D fabric technology was on Apple’s radar for future chip designs. Apple even filed a patent titled High Density Interconnection using Fanout Interposer Chiplet that incorporates this technology.
According to a report from Taiwanese financial site MoneyDJ, which boasts 1.5 million members and extensively covers technology news, Apple and AMD have favored TSMC’s 3D fabric technology. While it remains unknown when Apple will integrate this technology into their desktop and mobile devices, the report states that mass production is expected to commence in the third quarter of 2027 at TSMC’s advanced packaging plant in Zhuke Tongluo Park.
IT Home, a technology site, adds further details, stating that sources suggest Apple could potentially introduce the 3D stacking technology in a MacBook Pro between 2025 and 2027. AMD is expected to be the first customer to leverage this technology, with their MI300 chip already employing the system on chip (SoIC) with chip on wafer (CoWoS) technology. Additionally, IT Home claims that Apple is already conducting small-scale trial production of SoIC-based 3D stacking technology.
The increasing demand for AI chips has put pressure on TSMC to scale up their production capacity for 3D fabric and AI chips. Microsoft’s CEO recently issued a warning about potential service disruptions if an adequate supply of AI chips cannot be secured for their data centers.
In conclusion, Apple and AMD’s embrace of TSMC’s advanced 3D fabric technology highlights the importance of innovative packaging technologies in delivering high-performance computing devices. As technological advancements continue to push the boundaries of computing capabilities, TSMC’s 3D fabric technology is poised to play a crucial role in meeting the demands of future applications across various industries.
