The Biden administration has launched a new program aimed at boosting the US semiconductor industry by investing $3 billion in advanced packaging research and development. Advanced packaging involves stitching multiple chips together to create faster, cheaper, and more complex devices, such as those used in smartphones, biotechnology, and artificial intelligence. The program, known as the National Advanced Packaging Manufacturing Program, is part of the Biden administration’s efforts to implement the CHIPS and Science Act.
The goal of the program is to establish the United States as a global leader in commercial-scale advanced packaging by the end of the decade. Currently, most advanced packaging production is concentrated in Asia, particularly in Taiwan. China has also been investing in advanced packaging techniques. By investing in advanced packaging facilities in the US, the administration aims to secure supply chains and mitigate security risks associated with sending chips overseas for completion.
The Commerce Department has outlined six key areas where the $3 billion funding will be focused. The first area is materials and substrates, which are the components that attach chips to circuit boards. The department plans to open the competition for grants in early 2024. Research institutions like universities and national labs will be eligible to apply for funding, and they will have the option to collaborate with industry partners to develop a path to manufacturing.
Under Secretary of Commerce Laurie Locascio emphasized the need for the US to catch up with the Asian markets in advanced packaging production. She expressed confidence that with the right investments and partnerships, the US can become a global leader in this field. Locascio will be delivering a speech at Morgan State University in Baltimore to outline the program’s plan.
The Biden administration’s program aims to strengthen the US semiconductor industry and reduce dependence on foreign production. By investing in research and development in advanced packaging, the administration seeks to position the US as a leader in this critical technology sector. With the growing demand for advanced chips in various industries, the program is expected to have a significant impact on the future of semiconductor manufacturing in the United States.
Sources:
-[Biden Administration Launches $3B Advanced Packaging Program to Boost US Semiconductor Industry](https://www.semafor.ai/first-drafts/biden-administration-launches-3b-advanced-packaging-program-to-boost-us-semiconductor-industry)
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