Apple has reportedly secured the initial batch of TSMC’s cutting-edge 2nm chips for its upcoming iPhone 17 series, as per reports by the Taiwanese outlet Commercial Times. The new chips, expected to begin trial production this week, will be featured in the iPhone models set to be released in 2025.
The 2nm process technology is anticipated to deliver a performance enhancement of 10-15% compared to the existing 3nm chips, along with a significant reduction in power consumption by up to 30%. The installation of the necessary equipment for producing the 2nm chips took place at TSMC’s Hsinchu Baoshan fab earlier this year.
Furthermore, Apple is said to be planning to employ SoIC (System on Integrated Chips) packaging for its M5 chip in 2025. This innovative packaging technique involves stacking multiple chips with diverse functions to create a compact three-dimensional structure, potentially enhancing the overall efficiency and performance of the chip.
The reported alliance between Apple and Baidu for the incorporation of AI functions in China has garnered mixed responses. While some view this collaboration positively, others have expressed concerns regarding data privacy and security implications associated with such integration. The partnership aims to leverage Baidu’s expertise in AI technology to enhance Apple’s products and services in the Chinese market.
As Apple continues to explore advanced technologies and strategic partnerships, the tech industry eagerly awaits the impact of these developments on future innovations and consumer experiences.
